On July 17, PTI (Powertech Technology) announced a joint venture with Broadcom in Singapore to establish a panel-level packaging (PLP) facility – a key step in PTI's global capacity expansion to serve client supply chain needs.

PTI plans to invest $400 million (approx. RMB 2.71 billion) in the Singapore project, focusing on advanced packaging for high-performance chips.

From ICgoodFind: PLP is scaling beyond fan-out – and Broadcom just secured a dedicated site. PTI’s Singapore move signals that panel-level packaging is now a supply-chain-critical capability for AI silicon.